Aeroflex 2000SF Model · in TIM-Pad (Silicon Free)

Aeroflex 2000SF is a high-performance, compliant, silicone-free thermal interface material. By coupling extremely high…

Thermal conductivity
2 W/m·K
Thickness
0.25~10.0
Flame rating
V-0
Specification 19 properties · 1 models
PROPERTIESUNITTEST METHOD2000SF
Appearance-VisualWhite
ThicknessmmASTM D3740.25~10.0
Thermal ConductivityW/m·KHot Disk2.00
ASTM D54702.00
Thermal Resistance (@1mm, 20psi)°C·in²/WASTM D54700.70
°C·cm²/W4.52
HardnessShore OOASTM D224060
Flame Rating-U.L 94V-0
Dielectric Strength (@1MM)kVASTM D149>9.0
Volume ResistivityΩ·cmASTM D257≥1.0X10 14
Densityg/cm³ASTM D7922.40
Tensile StrengthpsiASTM D41236
Elongation%ASTM D41255
Compression Deflection (%) at given pressure10psiASTM D5758
50psi20
100psi35
Dielectric Constant@1MHzASTM D1506.5
Service Temp.°CLianxin-40~110
RoHS Compliant-LianxinYES

About the model

Aeroflex 2000SF is a high-performance, compliant, silicone-free thermal interface material. By coupling extremely high thermal conductivity (2.0W/m·K) with exceptional wetting characteristics, Aeroflex 2000SF provides low thermal resistance between heat source component and heat dissipation part or housing. This makes it well-suited for applications where silicone-based pads are traditionally used as well as those applications which are silicone-sensitive, especially in optical industry. Aeroflex 2000SF is naturally tacky on both sides requiring no additional adhesive coating. The natural tack allows the pad to be held in place during assembly.

Product Description Typical Property Data