Aeroflex TG803NS Model · in TIM-Gel (Silicon Free)
Aeroflex TG803NS is special designed for use in high performance devices requiring minimal thermal resistance for…
- Thermal conductivity
- 3.5 W/m·K
- Thickness
- ViaFides – 0.06
- Flame rating
- U.L. / 94 V-0
Specification
| PROPERTIES | UNITS | Test method | FC@TEST METHOD | TG803NS |
|---|---|---|---|---|
| Appearance | - | — | Visual | White |
| Flow Rate | g/min | — | ViaFides | 12 |
| Thermal Conductivity | W/m·K | — | Hot disk | 3.50 |
| Thermal Conductivity | W/m·K | — | ASTM D5470 | 3.50 |
| Thermal Resistance@ 20 psi | °C·in 2 /W | — | ASTM D5470 | 0.07 |
| Thermal Resistance@ 20 psi | °C·cm 2 /W | — | ASTM D5470 | 0.45 |
| Min.Used Thickness | mm | — | ViaFides | 0.06 |
| Flame Rating | - | — | U.L. | 94 V-0 |
| Volume Resistivity | Ω·cm | — | ASTM D257 | ≥1.0×10 13 |
| Dielectric Strength | kV(@ 1mm) | — | ASTM D149 | ≥8 |
| Density | g/cm 3 | — | ASTM D792 | 3.05 |
| Dielectric Constant | @1 MHz | — | ASTM D150 | 6.5 |
| TML(CVCM) | % | — | ASTM E595 | ≤0.15 (0.05) |
| CTE (Coefficient Thermal Expansion) | ppm/°C | — | ASTM E831 | 225 |
| Service Temp. | °C | — | ViaFides | -55 to 150 |
| RoHS Compliant | - | — | ViaFides | Yes |
About the model
Aeroflex TG803NS is special designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and eliminate silicone contamination. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform over irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances.
Product Description
Typical Property Data