Adhesive - EpoxyThermal Bonding Adhesive - 94-XXX Model · in LIANXIN-XERM

Electronic devices have become part of every-day use. Their design complexities, miniaturization, power consumption…

Specification 17 properties · 0 models
CharacteristicUnitParameter
Colour-Aluminum (gray)
Consistency25℃-
Colloid-130,000
94-3812C8,000
CAT.19030,000
CAT.3035,000
Specific gravity of colloid25℃1,81
Curing time25℃ 100g-
94-3812C5 hours
CAT.19030 min
CAT.305+ hours
hardness25℃(shore D)90
Tensile strength25℃(PSI)9,000
Bonding strength(AL and AL)2,500
Tensile strength25℃(PSI)18,500
Operating temperature-55~200
Thermal expansion coefficient-28x10 -6

About the model

Electronic devices have become part of every-day use. Their design complexities, miniaturization, power consumption, and thermal management issues challenge OEM engineers. The AERO 94-3812NC Aluminum Filled Epoxy Adhesive has been specifically designed for bonding heat sinks that require high thermal conductivity and strong structural bonds.
In addition to providing strong bonds and thermal conductivity, the 94-3812NC passes NASA’S outgassing requirements per ASTM E-595-07. The viscosity of this material is ideal for bonded fin heat sink applications and pipe bonding in extruded aluminum base applications.
The 94-3812NC is a two component epoxy system formulated to be cured at room temperature or with mild heat. The 10:1 mix ratio is easy for batch mixing or utilizing Meter Mix and Dispense Equipment.

Typical Property Data