Aeroflex S15H Model · in TIM-PAD
Aeroflex S15H is a very soft, freestanding thermal gap pad that is more compliant than most other materials. As a…
- Thermal conductivity
- 1.5 W/m·K
- Thickness
- 0.07~10.0 – 0.50~10.0
- Flame rating
- 94V-0
Specification
| PROPERTIES | UNIT | TEST METHOD | S15 | S15G | S15H | S15U |
|---|---|---|---|---|---|---|
| Appearance | - | Visual | Light Green | Dark Grey | Light Green | White/Brown |
| Thickness | mm | ASTM D374 | 0.07~10.0 | 0.07~10.0 | 0.07~10.0 | 0.50~10.0 |
| Thermal Conductivity | W/m·K | Hot Disk | 1.50 | 1.50 | 1.50 | 1.50 |
| Thermal Conductivity ASTM D5470 | 1.50 | 1.50 | — | — | ||
| Thermal Resistance (@1mm, 20psi) | °C·in²/W | ASTM D5470 | 0.98 | 0.90 | 0.90 | 0.90 |
| Thermal Resistance (@1mm, 20psi) °C·cm²/W | 5.81 | 5.81 | — | — | ||
| Hardness | Shore OO | ASTM D2240 | 45 | 25 | 25 | 5 |
| Flame Rating | - | U.L | 94V-0 | 94V-0 | 94V-0 | 94V-0 |
| Dielectric Strength (@1MM) | kV | ASTM D149 | >10.0 | >10.0 | >10.0 | >10.0 |
| Volume Resistivity | Ω·cm | ASTM D257 | ≥5.0X10 13 | ≥5.0X10 13 | ≥5.0X10 13 | ≥1.0X10 13 |
| Density | g/cm³ | ASTM D792 | 1.85 | 1.85 | 1.85 | 2.15 |
| Tensile Strength | psi | ASTM D412 | 30 | 30 | 30 | 35 |
| Elongation | % | ASTM D412 | 55 | 55 | 55 | 55 |
| Compression Deflection (%) at given pressure | 10psi | ASTM D575 | 32 | 18 | 18 | 23 |
| Compression Deflection (%) at given pressure 100psi | 62 | 83 | — | — | ||
| Dielectric Constant | @1MHz | ASTM D150 | 6.2 | 6.2 | 6.2 | 6.2 |
| TML (CVCM) | % | ASTM E595 | ≤0.55(0.10) | ≤0.55(0.10) | ≤0.55(0.10) | ≤0.55(0.10) |
| Service Temp. | °C | Lianxin | -60~200 | -60~200 | -60~200 | -60~200 |
| RoHS Compliant | - | Lianxin | YES | YES | YES | YES |
About the model
Aeroflex S15H is a very soft, freestanding thermal gap pad that is more compliant than most other materials. As a perfect blend of good thermal conductivity of 1.5 W/m·K and high conformability, this material produces low thermal resistance. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
Product Description
Typical Property Data